FAQ

A thermal interface material (TIM) is a substance with high thermal conductive properities, used to improve the transfer of heat between two surfaces. It is typically applied between a heat source, such as a microprocessor or a graphics card, and a heat sink, which helps dissipate the heat. The primary purpose of a TIM is to fill in microscopic air gaps and imperfections on the surfaces, allowing for better conduction of heat.

Thermal paste, (thermal compound or thermal grease) , is a type of thermal interface material (TIM) used to improve heat transfer between a heat source, such as a microprocessor, and a heat sink. It is a sticky substance typically made of a combination of silicone compounds, metal oxides, and other fillers.

1. Thermal Resistance measures the resistance to heat flow through the paste. The lower the thermal resistance, the better the thermal conductivity and heat transfer performance of the paste. (C/W)
2. Thermal Conductivity refers how well the thermal paste can transfer the heat. Higher the Thermal conductivity, will facilitate efficient heat transferbetween the heat source and the heat sink. (W/mK)
3. Viscosity refers to the consistency or thickness of the thermal paste. It affects the ease of application and how well the paste spreads between the heat source and heat sink. The viscosity should be balanced to allow for easy application without being too runny or too thick.

Better heat conduction, minimizing thermal resistance, and improving the contact between the heat source and heat sink, thermal paste significantly impacts cooling performance. It helps maintain lower temperatures, prevents overheating, and enhances the overall stability and longevity of electronic components.

No, thermal paste is not the only option to impact the cooling performance of a computer system. Factors like:
Heat Sink Design
Fan Performance
Case Airflow
Cooling Solution
Overclocking Considerations
Ambient Temperature
All of these Factor and the Thermal Paste work together to impact the Cooling performance. It is a part of holistic cooling solution.

The core strengths of our products are low thermal resistance, higher conductivity, lower viscosity and long term stability even at high temperatures.

The composition of the product is of higher quality and technically more advanced components.

High quality thermal paste has a good mixing ratio between high condcutive filling materials and also high conductive polymers.

Higher-quality thermal pastes tend to have better longevity and stability, potentially requiring less frequent renewal. Cheaper or lower-quality thermal pastes may dry out or degrade faster, necessitating more frequent reapplication.

It is advisable to consult the manufacturer’s guidelines for the specific thermal paste you are using.

We recommend replacing the pastes every 2 years if possible. It is also possible to use our pastes longer. If you install correct, you can use  our paste Up to 5 years.

We take care in the development of our products, that our pastes do not dry out as well as possible or dissolve into the components due to low viscosity.
With a lot and extreme use of the components, users replace the pastes in much shorter intervals than 2 years. Depends the usage.

No, they are not inferior in quality. All our products are durable and stable even with much use at higher temperatures. They do not dry out and they do not dissolve into their components.
We always use high quality polymers and oxides. However, there are differences in the processing of the surfaces and the size of the oxides, which may affect the possible thermal conductivity values of the cheaper products.
However, even our cheaper pastes and pads achieve high thermal conductivity values.
As an example, our cheaper pastes can achieve a thermal conductivity value of up to 12W/mK. Under normal use. However, if the temperature of your components goes higher because you overclock more often, then you should rather buy the expensive pastes.

The application in which you use the paste. Than as base like ambient temperatures, case, cooler type (low or high pressure mounting), airflow, CPU, GPU, the clock rates, gaming, overclocking and so on.
Most of these factors are application-dependent. The rest are smaller details.

Any of our products would not be a wrong solution. Because our Thermal Hero products make up for most of the weaknesses of the other factors with quality and performance. But the devil is in the details. Therefore, in creating a cooling solution, the topology of the components should also achieve the right efficiency.

Our products are divided into three performance categories. Find out more on our website.