Thermal Gap Filling Interface
Gap Compensation Between Components and Heatsinks
Conformable Interface for Uneven Contact Surfaces
Electrically Insulating Thermal Pad Structure
Multiple Thickness Options for Assembly Design
Thermal Gap Filling

GAP Series Thermal Pads

GAP Series thermal pads are engineered for reliable gap compensation and heat transfer between electronic components and cooling surfaces where direct contact is not possible.

Conductivity Range
3–12 W/mK
Selectable thermal performance classes for different assembly requirements.
Thickness Range
0.5–5.0 mm
Supports mechanical tolerances and variable component heights.
Hardness
Shore 00–70
Designed for conformability under controlled compression.
Electrical Behavior
Insulating
Suitable for electronic assemblies requiring dielectric separation.
01Key Features

GAP Series pads provide a compliant thermal interface for assemblies with uneven surfaces, tolerance stacks, or defined gap distances.

High conformability for uneven surfaces
Electrical insulation for safe integration
Multiple thickness options
Manual or automated assembly compatible
02Technical Specifications
Thermal Conductivity3–12 W/mK
Thickness Range0.5–5.0 mm
HardnessShore 00–70
Operating Temperature-40°C to +150°C
Electrical ConductivityNo
Application TypeGap filling thermal interface pad
03Application Areas

Suitable for electronic systems where thermal transfer, electrical insulation, and repeatable assembly behavior are required.

  • VRAM cooling and memory module interfaces
  • Power modules and high-load electronic assemblies
  • Automotive electronics and control units
  • Industrial PCBs and embedded electronics
04Advantages

GAP Series supports clean integration into industrial designs where dimensional tolerances must be compensated reliably.

01Compensates mechanical tolerances between components and cooling surfaces.
02Improves thermal contact where direct surface contact is not possible.
03Supports clean, repeatable, and production-friendly assembly workflows.
04Available in different conductivity and thickness classes for project-specific design.