Hybrid Thermal System

HYBRID-T Series – Transfer & Heat Spreading Combined

Vertical Heat Transfer + Lateral Spreading
Reduced Hotspot Concentration
Increased Thermal Efficiency
Optimized for High-Density Systems
Hybrid Thermal System

HYBRID-T Series – Combined Thermal Interface and Heat Spreading System

HYBRID-T Series combines thermal paste with graphene heat spreaders to create a multi-layer thermal management system that both transfers and redistributes heat.

Overview Multi-layer thermal architecture integrating vertical heat transfer and lateral heat spreading into one system for advanced cooling performance.
System Concept Combines TIM efficiency with graphene heat distribution to reduce localized hotspots, improve heatsink utilization, and support high-density thermal designs.
01Key Features
Combines vertical heat transfer with lateral heat spreading
Reduces localized hotspot concentration across high-power components
Improves thermal distribution before heat reaches the cooling solution
Optimized for compact, high-density and power-dense systems
02Technical Performance
Reduced peak temperatures under concentrated thermal load
Improved heat spreading across the contact interface
Enhanced cooling efficiency through better heatsink utilization
Supports stable operation in demanding thermal environments
03System Structure
Component
→
TIM Layer
→
Graphene Heat Spreader
→
TIM Layer
→
Cooling Solution
Cooling Solution / Heatsink
Thermal Interface Material
Graphene Heat Spreader
Thermal Interface Material
Component / Chip
04Application Areas
AI hardware and accelerator modules
High-performance computing systems
Industrial embedded electronics
Advanced cooling architectures with hotspot control
05Advantages
Combines the strengths of multiple thermal materials
Enables next-generation cooling design for compact systems
Improves thermal stability in high-power electronic assemblies
Ideal for applications where standard TIM alone is not sufficient
Contact our engineering team for hybrid thermal system design.