Thermal Paste
B2B Thermal Interface Solutions

Thermal Hero Thermal Pastes for Industrial and Performance Applications

This B2B product page presents the Thermal Hero thermal paste range in a structured industrial layout using the uploaded datasheet content for NEO, ULTRA, QUANTUM, and METALLIQ. It is arranged for OEM, distribution, industrial project work, and professional buyers who need fast access to product positioning, properties, and technical data.

THERMAL PASTE RANGE HERO IMAGE PLACEHOLDER
4Datasheet-Based Products
1g–50gPaste Range Coverage
B2BIndustrial and OEM Positioning

Product Range Overview

The product information below is populated from the uploaded datasheets. NEO is positioned for basic applications, ULTRA for advanced applications, QUANTUM for high-performance applications, and METALLIQ for extreme applications as a liquid metal compound. :contentReference[oaicite:4]{index=4} :contentReference[oaicite:5]{index=5} :contentReference[oaicite:6]{index=6} :contentReference[oaicite:7]{index=7}

NEO Basic users, home office users, and standard applications including laptops, small servers, and multi-media systems. :contentReference[oaicite:8]{index=8}
ULTRA Gamers, multimedia professionals, and advanced users requiring stronger cooling for gaming PCs, workstations, servers, and consoles. :contentReference[oaicite:9]{index=9}
QUANTUM Professional gamers, content developers, and IT specialists for high-end gaming rigs, workstations, servers, and extreme overclocking. :contentReference[oaicite:10]{index=10}
METALLIQ Extreme overclockers, HPC researchers, and industrial engineers requiring maximum heat dissipation in extreme applications. :contentReference[oaicite:11]{index=11}
01

NEO Thermal Paste

Basic Applications
IMAGE PLACEHOLDER — NEO THERMAL PASTE

Thermal Hero NEO is a high-performance thermal paste for basic applications with high thermal conductivity, low thermal resistance, easy application, and non-electrical conductivity. It is positioned for standard applications, laptops, small servers, and multi-media systems. :contentReference[oaicite:12]{index=12}

Key Features

  • High Thermal Conductivity
  • Low Thermal Resistance
  • High Cooling Performance
  • Long-Term Stability
  • Easy Application
  • Not Electrically Conductive

Datasheet

Sizes1g | 2g | 4g | 10g | 25g | 50g
Density2.8 g/cm3
Operating Temperature-50 ~ 220 °C
Application Temperature20 ~ 50 °C
Viscosity215 PAS
Electrically ConductiveNo
Storage ConditionsDry
Packaging Dimensions22x12x3 cm
Open Datasheet
02

ULTRA Thermal Paste

Advanced Applications
IMAGE PLACEHOLDER — ULTRA THERMAL PASTE

Thermal Hero ULTRA is intended for sophisticated users and gamers who require exceptional cooling performance. It is positioned for gaming PCs, workstations, medium-sized servers, laptops, and game consoles, and is suitable for air and water coolers, CPUs, GPUs, and overclocking. :contentReference[oaicite:13]{index=13}

Key Features

  • High Thermal Conductivity
  • Low Thermal Resistance
  • High Cooling Performance
  • Long-Term Stability
  • Easy Application
  • Not Electrically Conductive

Datasheet

Sizes1g | 2g | 4g | 10g | 25g | 50g
Density3.4 g/cm3
Operating Temperature-50 ~ 300 °C
Application Temperature20 ~ 50 °C
Viscosity240 PAS
Electrically ConductiveNo
Storage ConditionsDry
Packaging Dimensions22x12x3 cm
Open Datasheet
03

QUANTUM Thermal Paste

High-Performance Applications
IMAGE PLACEHOLDER — QUANTUM THERMAL PASTE

Thermal Hero Quantum is positioned for professional users and high-end gaming. It is intended for high-end gaming rigs, high-performance workstations, professional servers, laptops, game consoles, and extreme overclocking. It is described as best applied at room temperature around 20–22 °C and shows full cooling performance with increased contact pressure. :contentReference[oaicite:14]{index=14}

Key Features

  • Extremely High Thermal Conductivity
  • Very Low Thermal Resistance
  • Best Cooling Performance
  • Long-Term Stability
  • Easy Application
  • Not Electrically Conductive

Datasheet

Sizes1g | 2g | 4g | 10g | 25g | 50g
Density3.5 g/cm3
Operating Temperature-50 ~ 300 °C
Application Temperature20 ~ 50 °C
Viscosity230 PAS
Electrically ConductiveNo
Storage ConditionsDry
Packaging Dimensions22x12x3 cm
Open Datasheet
04

METALLIQ Liquid Metal Compound

Extreme Applications
IMAGE PLACEHOLDER — METALLIQ LIQUID METAL

The METALLIQ series is a high-performance liquid metal compound made from gallium, indium, and tin. It is positioned for extreme overclocking, HPC, industrial applications, gaming consoles, and laptops. The datasheet states that it is electrically conductive and warns not to use it on aluminum, aluminum/copper (DHT), or brass cooling plates. :contentReference[oaicite:15]{index=15}

Key Features

  • Extremely High Thermal Conductivity
  • Very Low Thermal Resistance
  • Liquid Metal Best Cooling Performance
  • Long-Term Stability
  • Electrically Conductive
  • Produced in Germany

Datasheet

Sizes1g | 2g | 5g
Density6.4 g/cm3
Operating Temperature-50 ~ 200 °C
Melting Temperature10 °C
Application Temperature10 ~ 120 °C
Electrically ConductiveYes
ColorSilver
Packaging Dimensions22x12x3 cm
Open Datasheet

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