PCM Series materials remain solid at room temperature and transition into a semi-liquid state under heat. This enables controlled surface wetting, reduced interface resistance and repeatable thermal contact without manual spreading.
Activation
~40–50°C
Phase transition range for adaptive contact behavior.
Conductivity
6–10 W/mK
Designed for stable thermal interface performance.
Phase State
Solid → Semi-Liquid
Clean handling during assembly; adaptive under heat.
Thickness
~0.2 mm
Controlled interface layer for repeatable assembly.
01Key Features
PCM Series is designed for clean assembly and adaptive thermal contact in systems where repeatability, handling and long-term interface behavior are important.
Self-adapting interface under operating heat
No manual spreading required during assembly
No pump-out effect under thermal cycling
Repeatable contact behavior over thermal cycles
02Technical Specifications
| Activation Temperature | ~40–50°C |
| Thermal Conductivity | 6–10 W/mK |
| Phase State | Solid → Semi-liquid |
| Thickness | ~0.2 mm |
| Electrical Conductivity | No |
03Application Areas
Suitable for applications where thermal interface material must be placed cleanly and perform consistently after activation under operating temperature.
CPUs / GPUs in compact thermal assemblies
Industrial computing systems and control units
Automated assembly lines with repeatable placement
Maintenance-free systems with stable interface requirements
04Advantages
The material supports cleaner production workflows and consistent contact behavior, especially where paste handling or manual application is not preferred.
1
Clean handling during production and assembly
2
Consistent thermal interface performance after activation
3
Suitable for scalable mass-production environments
