Description
Our THERMAL HERO thermal conductive PAD is developed according to the latest research and findings in the field of thermal management and thermal optimization. The NEO Thermal Pad composes of high-quality polymers and fillers with higher thermal conductivite values.
The material is flexible with good compression ratio to allow better compliance to unevenness to any surfaces.
It can also be easily customized into different shapes and sizes based on the requirements. of the application. Due to its low hardness and high compressibility the thermal pad is perfect for filling even the smallest gaps between component and the heat sink/cooler. Thus, the THERMAL HERO Thermal PAD ensures a constant and optimal heat transfer.
The NEO Thermal Pad is designed with excellent thermal stability, ensuring long-term performance and reliability. The Pads are electrically insulating to prevent any unwanted electrical conductivity or short circuits.
Features & Benefits
- Efficient and optimal heat transfer
- Excellent thermal conductivity
- Environmentally friendly, does not contain any toxic ingredients
- Good flexibility & compression ratio
- Flexible and can be easily bent and trim to customized sizes
- RoHS compliant
- Safe Handling
NEO Thermal Pad Applications
- PC peripherals / overclock systems CPU, GPU Laptops, MCM, Mobil Phones
- LCD Devices and Semiconductors
- PDP, High power density LED module, IGBT
- Aerospace, High Tech Audio/Video, 5G module units, Medical Equipments
- Optical communication Equipment
- Between any metal and electronic components Heat Transfer.