Graphene-Based Heat Spreader
Ultra-Thin Structure ~0.025 mm
High In-Plane Thermal Conductivity
Flexible and Adaptable Layer
No Pump-Out Effect
Graphene-Based Heat Spreader

SPREAD Series Heat Spreader

Ultra-thin graphene layers designed to redistribute concentrated thermal hotspots across a larger surface area. SPREAD Series supports lateral heat distribution, improves heatsink utilization and stabilizes thermal performance in compact electronic systems.

Thickness
~0.025 mm
Ultra-thin graphene-based layer
Function
Heat Spreading
Redistributes localized thermal peaks
Conductivity
High In-Plane
Optimized for lateral heat transfer
Temperature
-50°C to +200°C
Industrial operation range
01Key Features

The SPREAD Series is designed for compact assemblies where low profile, lateral heat movement and long-term interface stability are critical.

Ultra-thin ~0.025 mm structure for tight mechanical spaces
High in-plane conductivity for lateral hotspot distribution
Flexible layer for adaptable integration concepts
No pump-out behavior compared with paste-only interfaces
02Technical Specifications
Thickness~0.025 mm
FunctionHeat spreading
In-plane ConductivityVery high
Through-plane ConductivityLow
Electrical ConductivityYes
Operating Temperature-50°C to +200°C
03Application Areas

Suitable for electronics where concentrated heat must be redistributed before reaching the final heatsink or cooling structure.

High-density CPUs / GPUs in compact thermal assemblies
AI accelerators and high-load processing modules
Industrial electronics with localized hotspot zones
Thermal hotspot systems with limited contact area
04Advantages

By spreading heat laterally, the layer helps reduce thermal concentration and supports more efficient use of the available cooling surface.

1
Reduces localized thermal hotspots before heat reaches the heatsink
2
Improves heatsink utilization through wider heat distribution
3
Supports stable thermal behavior in compact electronic systems