TIM-P Series – High Performance Thermal Interface Material

TIM-P Series is engineered for demanding applications requiring enhanced thermal conductivity, controlled viscosity, and stable heat transfer under continuous load.

Conductivity Class

6–7 W/mK

Designed for high-load interfaces requiring improved thermal transfer.

Thermal Resistance

Low

Supports reduced interface resistance through controlled bond line formation.

Viscosity Class

Medium–High

Suitable for precise application and stable material placement.

Electrical Behavior

Insulating

Designed for electronic assemblies where electrical conductivity is not required.

01Key Features

TIM-P Series bridges the gap between standard and extreme thermal solutions for industrial assemblies with elevated performance requirements.

Enhanced thermal conductivity

Reduced bond line thickness

Optimized viscosity for precision application

High thermal stability under cyclic loads

Non-electrically conductive material behavior

Suitable for demanding industrial systems

02Technical Specifications

Thermal Conductivity	6–7 W/mK
Thermal Resistance	Low
Density	3.0–3.5 g/cm³
Operating Temperature	-40°C to +180°C
Electrical Conductivity	No
Viscosity	Medium–High

03Application Areas

Suitable for electronic and power assemblies where thermal transfer, processing control, and long-term interface stability are required.

High-performance computing modules
Automotive ECUs
Power electronics with IGBT or MOSFET interfaces
Data center infrastructure
Industrial control and converter assemblies

04Advantages

TIM-P Series supports stable system performance where thermal load, interface reliability, and repeatable integration are project-critical.

01Improves heat dissipation efficiency across demanding thermal interfaces.

02Supports reduced hotspot formation through improved interface contact.

03Maintains reliable behavior under elevated and cyclic thermal loads.

04Provides a practical high-performance material platform for industrial integration.