Extreme Performance Thermal Interface

Ultra-Low Thermal Resistance

Reduced Bond Line Thickness

Pressure-Based Mounting Behavior

Stable Long-Term Interface Contact

Extreme Thermal Interface Material

TIM-X Series – Ultra-Low Thermal Resistance for Extreme Cooling Performance

TIM-X Series is developed for high-density systems requiring very low interface resistance, pressure-based bond line optimization, and stable thermal contact under demanding operating conditions.

Conductivity Class

7–8+ W/mK

Designed for high-load interfaces where reduced thermal resistance is project-critical.

Resistance Class

Ultra-Low

Supports thin bond line formation when applied with suitable mounting pressure.

Material Density

3.5–4.0 g/cm³

High-density compound structure for demanding thermal interface applications.

Process Focus

Pressure-Based

Optimized for controlled compression rather than excessive manual spreading.

01Key Features

TIM-X Series is positioned as an extreme-performance material platform for assemblies where interface thickness and thermal resistance must be tightly controlled.

Ultra-low bond line thickness capability

High thermal transfer efficiency

High-density compound structure

Optimized for pressure-based mounting

Excellent long-term stability

Non-electrically conductive behavior

02Technical Specifications

Thermal Conductivity	7–8+ W/mK
Thermal Resistance	Ultra-low
Density	3.5–4.0 g/cm³
Operating Temperature	-50°C to +200°C
Electrical Conductivity	No
Viscosity	High

03Application Areas

Suitable for power-dense and high-performance assemblies where interface control, thermal load handling, and long-term contact stability are required.

AI accelerators
High-density CPUs and GPUs
Industrial computing systems
Aerospace electronics
Power-dense modules

04Advantages

TIM-X Series supports advanced thermal designs where material behavior, mounting pressure, and reduced interface resistance must work together.

01Supports very low thermal resistance through controlled thin-layer application.

02Improves interface contact when compressed by appropriate mounting pressure.

03Maintains stable material behavior under demanding thermal load profiles.

04Provides a high-performance platform for application-specific thermal optimization.